
Government Research and Engineering
In government defense research and engineering, superior components are just the beginning of keeping your citizens safe. Analog Devices, Inc. (ADI) is a trusted technology partner providing comprehensive solutions and capabilities to support defense innovation.
From advanced sensing to flexible edge processing, from components and boards to specially packaged SiPs and system modules, ADI’s transformative signal chain solutions accelerate modernization and warfighter readiness. ADI provides semiconductor and RF subsystem solutions that are trusted, secure, and resilient, enabling government research and engineering centers to meet the stringent quality metrics for the aerospace and defense industry.
Onshore capabilities position ADI engineers to collaborate directly with government innovation centers, as well as Federally Funded Research and Development Centers (FFRDCs) and University Affiliated Research Centers (UARCs).
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Our Solutions
Connect. Detect. Protect.

Advanced AESA Radar
- Hybrid and Digital Beamforming capabilities
- SW Defined solutions and Enablement Platforms
- SWaP C, Performance, leverage ADI system engineering
Space
- Integration of various process & product technologies
- Signal Chain Integration
- Unlimited access to ADI dies
Electronic Warfare
- Low latency, SWaP, Wideband, Programmability and mission convergenge
- Heterogeneous integration (SiP, Module)
- Enablement Platforms, ADI system engineering

Military Communications
- Antenna to Bit portfolio
- SW Defined solutions, ADI system engineering
Avionics
- Autonomous Smart Vehicle
- Weather and Traffic Awareness
- Automotive Synergies (BMS, Qual)
- Precision, RF, Power, IMU
ADI Solutions Go Beyond Semiconductor Components
ADI provides the aerospace and defense ecosystem with innovative technologies that modernize equipment to meet national security demands for connectivity, deterrence, and competitive overmatch. Through a combination of tried and true components, sophisticated system level platforms, and complete up the stack integration, ADI has enabled a more resilient supply chain.
Our advanced packaging capabilities, System in Package (SiP), modules and integrated RF/Microwave subsystems incorporate the highest levels of performance and integration while meeting stringent SWaP goals for mission critical applications.
ADI Integration Capabilities

Components
- Highly integrated
- Differentiated performance
- Includes HiRel Space products

异构集成SiP(系统级封装)
- 集成各种工艺和产品技术
- 信号链集成
- 无限制使用ADI芯片

商业标准/任务就绪模块
- 垂直整合
- 掌握严苛MIL环境方面的专业知识
- 在美国或爱尔兰组装和测试
连接、协作、共同创造
ADI积极寻求与美国政府科技领袖以及国防研究和工程组织合作。ADI航空航天和防务团队正在寻求与美国政府实验室、研究创新中心、联邦资助研究与发展中心(FFRDC)或大学附属研究中心(UARC)开展合作,共同推进关键项目和计划。

在即将举行的活动中与ADI交流
ADI公司积极参与各类会议和研讨会,热衷于发挥其影响力。参与即将举行的活动,了解有关ADI解决方案的更多信息,观看产品演示,并与我们的技术专家联系。


GOMACTech年度大会
2024年3月25-28日
美国南卡罗来纳州查尔斯顿

相控阵
2024年10月15-18日
美国马萨诸塞州波士顿
