Save time and deliver your solutions faster with ADI’s new suite of precision technology signal chains. Align your applications ranging from Smart Industry to Instrumentation, Electrification to Digital Health, to exactly the right precision technology combinations.
Tailor your signal chain with confidence
REF01
Obsolete+10V Precision Voltage Reference
- Part Models
- 19
- 1ku List Price
- Starting From $1.77
Part Details
- High output accuracy: 10.0 V Output, ±0.3% maximum
- Adjustable output: ±3% minimum
- Excellent temperature stability: 8.5 ppm/°C maximum
- High supply voltage range: up to 36 V maximum
- Low supply current: 1.4 mA maximum
- High load-driving capability: 10 mA maximum
- Temperature output function
- Low Noise: 30 µVP-P typical
The REF01 / REF02 / REF03 series of precision voltage references provide a stable 10.0 V, 5.0 V, or 2.5 V output with minimal change in response to variations in supply voltage, ambient temperature or load conditions. The devices are available in 8-lead SOIC, PDIP, CERDIP, and TO-99 packages, as well as 20-terminal LCC packages (883 only), furthering the usability of the devices in both standard and high stress applications.
With an external buffer and a simple resistor network, the TEMP terminal can be used for temperature sensing and approximation. A TRIM terminal is also provided on the device for fine adjustment of the output voltage.
The small footprint, wide supply range, and application versatility make the REF0x series of references ideal for general-purpose and space-constrained applications.
Newer designs should use the ADR01 / ADR02 / ADR03 / ADR06 series of references, which offer higher accuracy and temperature stability over a wider operating temperature range, while maintaining full pin-for-pin compatibility with the REF01 / REF02 / REF03 series. This data sheet applies to commercial-grade products only. Contact sales or visit analog.com for military-grade (883) data sheets.
APPLICATIONS
- Precision data systems
- High resolution converters
- Industrial process control systems
- Precision instruments
- Military and aerospace applications
Documentation
Data Sheet 2
Reliability Data 1
Application Note 1
Frequently Asked Question 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| 5962-8958101PA | 8 ld CerDIP | ||
| REF01AJ/883C | 8-Pin TO-99 | ||
| REF01CESA+ | Small-Outline IC, Narrow (0.15in) | ||
| REF01CESA+T | Small-Outline IC, Narrow (0.15in) | ||
| REF01CJ | 8-Pin TO-99 | ||
| REF01CP+ | Plastic Dual-In-Line, Narrow (0.3in) | ||
| REF01CPZ | 8-Lead PDIP | ||
| REF01CSA+ | Small-Outline IC, Narrow (0.15in) | ||
| REF01CSA+T | Small-Outline IC, Narrow (0.15in) | ||
| REF01CSZ | 8-Lead SOIC | ||
| REF01CSZ-REEL | 8-Lead SOIC | ||
| REF01CSZ-REEL7 | 8-Lead SOIC | ||
| REF01EP+ | Plastic Dual-In-Line, Narrow (0.3in) | ||
| REF01EZ | 8-Lead CerDIP | ||
| REF01HP+ | Plastic Dual-In-Line, Narrow (0.3in) | ||
| REF01HPZ | 8-Lead PDIP | ||
| REF01HSA+ | Small-Outline IC, Narrow (0.15in) | ||
| REF01HSA+T | Small-Outline IC, Narrow (0.15in) | ||
| REF01HZ | 8-Lead CerDIP |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Apr 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
||
| 5962-8958101PA | PRODUCTION | |
| REF01AJ/883C | ||
|
Sep 7, 2017 - 17_0079 Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing |
||
| 5962-8958101PA | PRODUCTION | |
| REF01AJ/883C | ||
| REF01CJ | ||
| REF01CSZ | PRODUCTION | |
| REF01CSZ-REEL | PRODUCTION | |
| REF01CSZ-REEL7 | PRODUCTION | |
| REF01EZ | ||
| REF01HZ | ||
|
Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
||
| 5962-8958101PA | PRODUCTION | |
| REF01EZ | ||
| REF01HZ | ||
|
Jun 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite |
||
| 5962-8958101PA | PRODUCTION | |
| REF01AJ/883C | ||
|
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
||
| 5962-8958101PA | PRODUCTION | |
| REF01AJ/883C | ||
| REF01CJ | ||
| REF01EZ | ||
| REF01HZ | ||
|
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
||
| 5962-8958101PA | PRODUCTION | |
| REF01AJ/883C | ||
| REF01CJ | ||
| REF01CPZ | PRODUCTION | |
| REF01EZ | ||
| REF01HPZ | PRODUCTION | |
| REF01HZ | ||
|
Jul 31, 2009 - 09_0106 Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products |
||
| 5962-8958101PA | PRODUCTION | |
| REF01AJ/883C | ||
|
Jun 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages |
||
| REF01AJ/883C | ||
| REF01CJ | ||
|
Oct 30, 2020 - 1702R2 ASSEMBLY |
||
| REF01CESA+ | PRODUCTION | |
| REF01CESA+T | PRODUCTION | |
| REF01CSA+ | PRODUCTION | |
| REF01CSA+T | PRODUCTION | |
|
Oct 11, 2012 - 12_0208 ADR0x and REF0x Die Revision |
||
| REF01CJ | ||
| REF01CPZ | PRODUCTION | |
| REF01CSZ | PRODUCTION | |
| REF01CSZ-REEL | PRODUCTION | |
| REF01CSZ-REEL7 | PRODUCTION | |
| REF01EZ | ||
| REF01HPZ | PRODUCTION | |
| REF01HZ | ||
|
Mar 23, 2009 - 09_0005 REF01, REF02 and REF03 Redesign: Startup Circuitry Design Improvement and Input Voltage Maximum Rating Data Sheet Change |
||
| REF01CJ | ||
| REF01CPZ | PRODUCTION | |
| REF01CSZ | PRODUCTION | |
| REF01CSZ-REEL | PRODUCTION | |
| REF01CSZ-REEL7 | PRODUCTION | |
| REF01EZ | ||
| REF01HPZ | PRODUCTION | |
| REF01HZ | ||
|
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
||
| REF01CPZ | PRODUCTION | |
| REF01HPZ | PRODUCTION | |
|
Jul 20, 2012 - 12_0105 Halogen Free Material Change for Select SOIC Narrow and Wide Body Products Assembled at Amkor |
||
| REF01CSZ | PRODUCTION | |
| REF01CSZ-REEL | PRODUCTION | |
| REF01CSZ-REEL7 | PRODUCTION | |
|
May 22, 2018 - 1702N ASSEMBLY |
||
| REF01HSA+ | PRODUCTION | |
| REF01HSA+T | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
Hardware Ecosystem
| Parts | Product Life Cycle | Description |
|---|---|---|
| ADR01 | PRODUCTION | Ultracompact, Precision 10.0 V Voltage Reference |
Latest Discussions
No discussions on REF01 yet. Have something to say?
Start a Discussion on EngineerZone®